HSB12-272706

Manufacturer:
CUI Devices
Part Number:
HSB12-272706
Category:
Heat Sinks
Description:
HEAT SINK, BGA, 27 X 27 X 6 MM
Datasheets:
RoHS Status:
Lead free/Rosh Compliant
In Stock:
1,455

Specifications

TYPE
DESCRIPTION
Manufacturer :
CUI Devices
Category :
Heat Sinks
Attachment Method :
Adhesive
Diameter :
-
Fin Height :
0.236" (6.00mm)
Length :
1.063" (27.00mm)
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
3.8W @ 75°C
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
7.80°C/W @ 200 LFM
Thermal Resistance @ Natural :
19.59°C/W
Type :
Top Mount
Width :
1.063" (27.00mm)

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  • From $40.00 basic shipping fee depend on zone and country.

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