HSB03-121218

Manufacturer:
CUI Devices
Part Number:
HSB03-121218
Category:
Heat Sinks
Description:
HEAT SINK, BGA, 12 X 12 X 18 MM
Datasheets:
RoHS Status:
Lead free/Rosh Compliant
In Stock:
2,082

Specifications

TYPE
DESCRIPTION
Manufacturer :
CUI Devices
Category :
Heat Sinks
Attachment Method :
Adhesive
Diameter :
-
Fin Height :
0.709" (18.00mm)
Length :
0.472" (12.00mm)
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
3.1W @ 75°C
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
9.60°C/W @ 200 LFM
Thermal Resistance @ Natural :
24.01°C/W
Type :
Top Mount
Width :
0.472" (12.00mm)

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  • From $40.00 basic shipping fee depend on zone and country.
  • From $40.00 basic shipping fee depend on zone and country.
  • From $40.00 basic shipping fee depend on zone and country.
  • From $40.00 basic shipping fee depend on zone and country.

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