HSB20-353525

Manufacturer:
CUI Devices
Part Number:
HSB20-353525
Category:
Heat Sinks
Description:
HEAT SINK, BGA, 35 X 35 X 25 MM
Datasheets:
RoHS Status:
Lead free/Rosh Compliant
In Stock:
446

Specifications

TYPE
DESCRIPTION
Manufacturer :
CUI Devices
Category :
Heat Sinks
Attachment Method :
Adhesive
Diameter :
-
Fin Height :
0.984" (25.00mm)
Length :
1.378" (35.00mm)
Material :
Aluminum Alloy
Material Finish :
Black Anodized
Package Cooled :
BGA
Power Dissipation @ Temperature Rise :
11.3W @ 75°C
Product Status :
Active
Shape :
Square, Pin Fins
Thermal Resistance @ Forced Air Flow :
2.70°C/W @ 200 LFM
Thermal Resistance @ Natural :
6.65°C/W
Type :
Top Mount
Width :
1.378" (35.00mm)

Request A Quote(RFQ)

please submit the following information

* Part Number
Manufacturer
Quantity
* Name
Company
* E-mail

Payment Method

  • The fee is charged according to the rule of HSBC.
  • The fee is charged according to the rule of PayPal.
  • The fee is charged according to the rule of WESTERN UNION.

Shipping information

  • From $40.00 basic shipping fee depend on zone and country.
  • From $40.00 basic shipping fee depend on zone and country.
  • From $40.00 basic shipping fee depend on zone and country.
  • From $40.00 basic shipping fee depend on zone and country.
  • From $40.00 basic shipping fee depend on zone and country.
  • From $40.00 basic shipping fee depend on zone and country.
  • From $40.00 basic shipping fee depend on zone and country.

Recommended Products